I-photolithography ye-ultraviolet egqithisileyo (EUV): itekhnoloji exhasa ikamva leetships

Xa kuxoxwa ngekamva leetships, ezona fowuni zinamandla, okanye ubukrelekrele bokwenziwa obuzayo, kukho igama elinye elihlala livela kwincoko: i-photolithography ye-ultraviolet extreme, ekwabizwa ngokuba yi-EUV lithographyLe teknoloji iye yaba yingxaki enkulu kwaye yaba negalelo ekuphuhliseni ii-semiconductors eziphambili kwihlabathi.

Nangona le ngcamango ivakala ngathi yeyobuchwephesha kakhulu, ukuqonda ukuba yintoni i-lithography ye-EUV, indlela esebenza ngayo, ngubani oyilawulayo, kunye nefuthe enalo kwi-geopolitics nakwizoqoqosho lwehlabathi kubalulekile ekuqondeni ukuba kutheni kukho ukunqongophala kweetshiphusi, kutheni amanye amazwe elwa ngezi matshini, kunye nesizathu sokuba iinkampani zithande. I-ASML, i-TSMC, i-Samsung okanye i-Intel Baye baba ngamaqhinga kwihlabathi liphela.

Yintoni i-photolithography ye-ultraviolet extreme (EUV)?

Kwishishini le-semiconductor, i-EUV lithography ibhekisa kwi indlela ye-photolithography esebenzisa ukukhanya okugqithisileyo kwe-ultraviolet enobude bomda obuzii-nanometers ezili-13,5, oko kukuthi, kummandla we-X-rays ezithambileyo ngaphakathi kwe-electromagnetic spectrum. Olu bude bomda bufutshane kakhulu kunobokukhanya okubonakalayo (400-700 nm) kwaye bukwanobo be-lithography ye-ultraviolet enzulu (DUV), esebenza kwi-248 nm (KrF) okanye kwi-193 nm (ArF).

Ukusetyenziswa kwale wavelength imfutshane kakhulu kuvumela chaza iipateni ezincinci kakhulu nezixineneyo kwii-silicon wafers, nto leyo ethetha ukuba kunokwenzeka ukudibanisa iibhiliyoni zee-transistors kwi-chip enye. Isizukulwana ngasinye esitsha se-lithographic nodes (7 nm, 5 nm, 3 nm, 2 nm, 1,8 nm…) siza nee-chips ezikhawulezayo, ezinomthamo omkhulu kunye ne-a ukusetyenziswa kwamandla okuphantsi kakhulu.

I-Photolithography, nokuba ikwi-DUV okanye kwi-EUV, ngokusisiseko ibandakanya bonisa ipateni yejiyometri kwi-wafer egqunywe nge-photoresistLe photopolymer iyatshintshwa xa ikhanyiswa ngokukhetha ngemaski (okanye i-photomask), ukuze iindawo eziveziweyo zinyibilike okanye zinganyibiliki, nto leyo evumela izakhiwo ezincinci ukuba zikrolwe kwi-substrate. Nge-EUV, umgaqo wendalo uyafana, kodwa ubunzima bobuchwephesha benkqubo buyanda kakhulu.

Inyani ebalulekileyo kukuba Ubude bomphezulu obuyi-13,5 nm buncinci ngokuphindwe kalishumi kunaleyo isetyenziswa kwiiskena ze-ArF (193 nm). Ngenxa yoku, izixhobo ze-EUV zinokuprinta iinkcukacha ezincinci kune-20 nm, into enokufezwa yi-lithography eqhelekileyo kuphela ngeendlela ezintsonkothileyo, ezicothayo, nezibizayo zeepateni ezininzi.

Indlela eveliswa kwaye iphathwa ngayo ukukhanya kwe-EUV

Ukuvelisa ukukhanya kwe-13,5 nm ngendlela elawulwayo kunye namandla afunekayo enye yeengxaki ezinkulu zobugcisa zale teknolojiKwiinkqubo zangoku, umthombo we-laser we-CO₂ onamandla aphezulu Idubula iipulses ezimbini ezikhawulezayo kakhulu kwithontsi elincinci elihambayo lesitya solwelo. Ipulse yokuqala iyayitshintsha ithontsi; eyesibini, ipulse enamandla ngakumbi, iyayitshintsha ibe ngumphunga, yenze iplasma.

Le plasma ye-hot tin ikhupha imitha ye-EUV, ebanjwa sisibuko sokuqokelela ize ithunyelwe kuyo yonke inkqubo ye-optical. Le nkqubo iphindaphinda ngesantya esimangalisayo, malunga Amaxesha angama-50.000 ngomzuzwanaukuvelisa ukuhamba kokukhanya okunamandla ngokwaneleyo ukugcina izinga lemveliso kwimizi-mveliso.

Ekubeni imitha ye-EUV ifunxwa ngumoya, indlela ehamba ngayo ukusuka kumthombo ukuya kwi-wafer kufuneka ibe ngaphakathi igumbi lokucoca elikumgangatho ophezuluNgaphezu koko, naluphi na uthuli okanye naluphi na ukungalingani okuncinci kwizinto ezibonakalayo kunokonakalisa umfanekiso oqikelelweyo, ngoko ke iimfuno zokucoceka, ukuzinza koomatshini, kunye nolawulo lokungcangcazela zigqithisile.

Izibuko ezikhanyayo, izibuko ezingenakwenzeka, kunye neemaski ezikhethekileyo

Ngokungafaniyo ne-DUV lithography, esebenzisa iilensi zokudlulisa kunye neemaski ze-quartz ezicacileyo, i-EUV lithography isekelwe kwi i-optics ebonakalisa ngokupheleleyoIsizathu silula: phantse zonke izinto, kuquka neglasi esetyenziswa kwiilensi zemveli, zifunxa ukukhanya kwe-13,5 nm.

Endaweni yeelensi, iinkqubo ze-EUV zisebenzisa inkqubo equlathe izibuko ezineeleya ezininzi ezichanekileyo kakhulu Ezi zipili zikhokela kwaye zijolisa umqadi ukusuka kumthombo ukuya kwi-wafer. Zenziwe ngamaleko amaninzi atshintshanayo ezinto ezahlukeneyo ezigcinwe ngokuchanekileyo kweathomu, ezivumela ukuba zibonakalise imitha ye-EUV ngokusebenza okuphezulu ngaphakathi kwemida yefiziksi.

Nangona kunjalo, nangona kukho ezi zisombululo zintsonkothileyo, isibuko ngasinye sifunxa inxalenye enkulu yokukhanya esikufumanayo. Iinkqubo zangoku ze-ASML zisebenzisa ubuncinane izibuko ezimbini ze-condenser kunye nezibuko ezintandathu ze-projection, kwaye xa zidibene, Malunga ne-96% yokukhanya okukhutshiweyo iyalahleka.Oku kufuna ukuba umthombo we-EUV ukhanye ngokungaqhelekanga ukuze, emva kwayo yonke imbonakalo, amandla aneleyo afikelele kwi-wafer.

Iimaski nazo zahlukile: endaweni yokuba zibe ziipleyiti ezicacileyo ezineendawo ezingacacanga, ii-EUV zisebenzisa iimaski ezibonisa ukukhanyaEzi nazo zineeleya ezininzi, zinemizobo ebhalwe kuzo njengee-reliefs kunye neengubo eziguqula ukukhanya. Nasiphi na isiphene kwimaski okanye kwizipili ngoko nangoko siphumela kwiimpazamo zokuprinta, kwaye ke ngoko, ii-wafers ezinesiphene.

Yintoni eyenza oomatshini be-ASML be-EUV babe ngabakhethekileyo kangaka?

Oomatshini be-EUV photolithography abenziwe yinkampani yaseDatshi i-ASML, ngokoqobo, ezinye zezona matshini zintsonkothileyo zakha zakhiwaIyunithi enye yesizukulwana sokuqala se-EUV idibanisa izinto ezingaphezu kwe-100.000, iintambo ezimalunga nama-3.000, iibholiti ezingama-40.000, kunye neentambo zombane zangaphakathi ezimalunga neekhilomitha ezimbini. Kwaye konke oku kulungelelaniswe ngokugqibeleleyo yisoftware yokulawula enobuchule kakhulu.

Olu nqanaba lobunzima lwenza izixhobo zibe nkulu kakhulu: umatshini ngamnye uthatha indawo efana neye ibhasi yesixeko Kwaye ifuna iimodyuli ezininzi ezincedisayo, iinkqubo zokupholisa, izixhobo zokucoca umoya, kunye ne-elektroniki echanekileyo. Ngaphezu koko, azithunyelwa zihlanganiswe ngokupheleleyo; zithuthwa ngamakhulu eekreyithi kwaye zihlanganiswe kwaye zilinganiswe kwindawo yazo kwimizi-mveliso yabathengi.

Impumelelo enkulu ye-ASML ikwinethiwekhi yayo yamaqabane kwezobuchwepheshe. Iinxalenye ezingama-90% zezi matshini zivela kwabanye abavelisi zisasazwa kwihlabathi liphela. Phakathi kwazo, amagama amabini aphambili avelele: iCymer kunye neZEISS, zombini zibaluleke kakhulu kwi-lithography ye-EUV ukuze isebenze ngendlela efanele.

Igalelo le-ZEISS: i-optics kwimida yefiziksi

Elinye iqabane eliphambili yi-ZEISS, inkampani yaseJamani yembali ye-high-precision optics. I-ZEISS iyila kwaye ivelisa le Izixhobo ze-EUV ezibonakalayo ezibonakalayo ukusuka kwi-ASML, ukusuka kwizipili zokuqala eziqokelelayo ukuya kwi-optics eyinkimbinkimbi edlulisela ipateni kwi-silicon.

Ezi zipili kufuneka zisebenze ngobude bobude 13,5 nm igcina ukufana kunye nokuchaneka yesimo samaza esigqithisileyo. Ukuthe tyaba komphezulu kukuba, ukuba isibuko besikhulisiwe saya kufikelela kubukhulu belizwe, ukungahambelani bekuya kuba ngaphantsi kokuphakama kwencakuba yengca. Nakuphi na ukuphambuka okungabonakaliyo kuya konakalisa ipateni kwaye kwenze i-wafer ingasebenzi.

Ukongeza kwizibuko, i-ZEISS ibandakanyeka ekuphuhliseni izinzwa kunye nee-actuators ezilungisa ngexesha langempela Le nkqubo ibona ukuguquguquka okuncinci, ukufuduka, okanye ukungcangcazela okunokwenzeka ngexesha lokusebenza. Ikwabonelela ngesoftware ehlala ijonga indlela esebenza ngayo inkqubo ye-optical kwaye iqinisekise ukuba ihlala ngaphakathi kokunyamezelana okungqongqo kakhulu.

I-High-NA EUV: isizukulwana esitsha esaphula umqobo we-3nm

Emva kweminyaka eliqela yokudibanisa isizukulwana sokuqala sezixhobo ze-EUV, i-ASML ithathe inyathelo elilandelayo ngoomatshini bayo be- i-aperture ephezulu yamanani, eyaziwa ngokuba yi-High-NA EUVEyona modeli yezorhwebo imele kakhulu yiTwinscan EXE:5200, ethathwa njengesixhobo se-lithography esiphucukileyo namhlanje ehlabathini.

Isitshixo sezi nkqubo zintsha sisekunyukeni kokuvulwa kwamanani kwenkqubo ye-optical: isuka kwi-NA = 0,33 kwizixhobo ze-EUV zangoku iye kwi I-NA = 0,55 kwi-High-NANgokubanzi, oku kuvumela ukuprintwa kweenkcukacha ezincinci nangakumbi kubude obufanayo be-13,5 nm, okuphucula isisombululo seepateni ezidluliselwe kwi-wafer.

Ngenxa yolu phuculo, izixhobo ze-High-NA EUV zivula ucango lokuvelisa iisekethe ezidibeneyo ngaphaya komda wezorhwebo we-3 nmukuvumela amaqhuqhuva ajikeleze i-2 nm kwaneteknoloji ye-18A (1,8 nm) ecetywayo yi-Intel. Ngaphezu koko, i-ASML iphucule iinkqubo zokuphatha ii-wafer ukuze umatshini omnye we-High-NA ukwazi ukucubungula ii-wafers ezingaphezu kwama-200 ngeyure, nto leyo ibalulekileyo ekugcineni iindleko ezikhuphisanayo ngetshiphusi nganye.

Ixabiso lomatshini weHigh-NA liqikelelwa ukuba limalunga I-300 yezigidi zeerandi ngeyunithi nganyeOko kuphantse kuphindwe kabini kunexabiso le-EUV yesizukulwana sokuqala, ebiza malunga ne-150 yezigidi. Nangona kunjalo, kubavelisi abafuna ukuhlala phambili, lutyalo-mali oluyimfuneko.

Ulawulo lwetekhnoloji olunempembelelo enkulu kwezopolitiko

Kwimarike ye-lithography ye-EUV, kukho inyani enye engenakuphikiswa: I-ASML kuphela komvelisi onokukwazi ukuvelisa ezi matshini kwinqanaba lemizi-mveliso. Olu hlobo lokulawula luguqulela ekubeni yindawo yamandla engazange ibonwe ngaphambili ngaphakathi kwekhonkco lexabiso le-semiconductor.

Iinkampani ezinkulu ezifana neTSMC, iSamsung, kunye neIntel zixhomekeke kwizixhobo ze-ASML ze-EUV ukuvelisa iitships zazo eziphambili. ikota yengeniso Ingeniso ye-ASML sele ivela ngqo ekuthengisweni kweenkqubo ze-EUV, ngaphandle kwezivumelwano zenkonzo, ukuphuculwa, uqeqesho kunye nokugcinwa.

Le ndawo yetekhnoloji ikwanayo ne ubukhulu obucacileyo bezopolitikoUkungavisisani phakathi kwe-United States ne-China kubeke i-lithography ye-EUV embindini wengxoxo. I-Washington icinezele iNetherlands ukuba inciphise ukuthunyelwa kweematshini zayo eziphambili e-China, ijolise ekunciphiseni ukufikelela kwelizwe lase-Asia kwiindawo ezisemgangathweni. Okwangoku, abavelisi baseJapan abanjengoCanon bahlola ezinye iindlela ezifana ne-nanoimprint lithography (NIL), ekwaziyo ukuvelisa iindawo ze-2nm, kodwa okwangoku, i-EUV isaqhubeka nokuba ngumgangatho ophambili kubuchwepheshe.

Kutheni i-lithography ye-EUV ibaluleke kangaka kwiitships zanamhlanje

Ukubaluleka kwe-lithography ye-EUV kuqondwa ngcono ngokujonga izixhobo esizisebenzisa imihla ngemihla. Uninzi lwezi ii-smartphones, ii-smartwatches, ii-consoles zemidlalo yevidiyo kunye neekhompyutha zakutshanje, zombini kwi uyilo lweetshiphusi Njengakwimveliso yabo, basebenzisa ii-CPU, ii-GPU, ii-SoC kunye neememori ezenziwe nge-7nm, 5nm okanye ii-nodes ezisezantsi, apho i-EUV sele ibalulekile kwiileya ezithile zenkqubo.

Umzekelo, iSamsung ibhengeze ukusetyenziswa kwe-EUV ukuvelisa Iitships ze-7nm ezibizwa ngokuba yi-7LPPEzi teknoloji ziya kuba sisiseko sokuvumela iinethiwekhi ze-5G ezinomthamo ophezulu, usetyenziso oluphambili lwe-artificial intelligence, i-Intanethi yezinto, kunye neenkqubo zokuqhuba ezizimeleyo. Ngokutsho kwenkampani, ukutshintshela kwi-EUV kuvumela ukuncipha kokusetyenziswa kwamandla ukuya kuthi ga kwi-50%, ukunyuka kokusebenza nge-20%, kunye nokwehla okumalunga ne-40% kweempawu xa kuthelekiswa nobuchwepheshe be-ArF obusekelwe kwiipatheni ezininzi zangaphambili.

Iinkampani ezifana neApple, iHuawei, kunye nabanye abayili beetships abaphambili nabo baxhomekeke kuzo. Iinkampani ezisungula izinto ezisebenzisa i-EUV ukuze sikwazi ukubonelela ngezixhobo ezikhawulezayo nezisebenzayo. Kwaye akupheleli nje ekusetyenzisweni kwamandla aluhlaza: ukunciphisa ukusetyenziswa kwamandla kunye nobushushu kubalulekile kwiifowuni eziphathwayo, iilaptops, kunye neeseva ukuze zisebenze ngcono ngaphakathi kwemida efanelekileyo yobushushu.

Iingenelo eziphambili ze-lithography ye-EUV xa kuthelekiswa ne-DUV

Inzuzo yokuqala enkulu ye-EUV lithography kukuba kungenzeka printa iimpawu ezincinci kakhuluNgobude obufutshane kangaka be-wavelength kunye nokuvulwa okufanelekileyo kwamanani, izakhiwo zinokwenziwa ngendlela yokuba, ngobukhulu obufanayo be-chip, ziphindaphinde inani lee-transistors ezikhoyo ngamaxesha amaninzi xa kuthelekiswa nobuchwepheshe bangaphambili.

Oku kuguqulelwa kwiitships kunye amandla amakhulu okucubungula, imemori edibeneyo ngakumbi Kwaye, ngaphezu kwako konke, ukusetyenziswa kwamandla okuphantsi kakhulu ngokusebenza ngakunye. Kwiziko ledatha, iinethiwekhi zonxibelelwano, okanye usetyenziso olukhulu lwe-AI, olu phuculo ekusebenzeni kakuhle kwamandla lunempembelelo enkulu kwiindleko zokusebenza.

Inzuzo yesibini inxulumene nenkqubo: i-EUV ivumela ukunciphisa inani lamanyathelo e-lithographic afunekayo ukufezekisa ipateni efanayo. Ngelixa i-ArF kunye neendlela ze-multi-pattern zinokufuna ukuvezwa okuthathu okanye okune okwahlukileyo ukuze kufezekiswe isakhiwo esintsonkothileyo, i-EUV idla ngokufuna enye kuphela. Oku kwenza kube lula ukuhamba kokwenziwa, kuphucula isivuno, kwaye kunokunciphisa iindleko nge-chip nganye kwixesha eliphakathi.

Ngaphezu koko, ngokukwazi ukugxila ngakumbi ekusebenzeni kwindawo encinci, kuvula ucango lolwakhiwo lwenkqubo-on-a-chip oludibeneyo ngakumbi, kunye neebhloko ze-CPU, i-GPU, ii-AI accelerators, imemori, kunye ne-logic ethile ehlala kunye kwiqhekeza elinye le-silicon—into esebenzayo kuphela xa uxinano oluphezulu kakhulu lokudibanisa.

Iingxaki zangoku kunye nemida ye-EUV

Umqobo ophambili kwi-lithography ye-EUV, ngokungathandabuzekiyo, kukuba ixabiso eliphezulu kakhulu loomatshini kunye neziseko zophuhliso abazidingayo. Asithethi nje ngezixhobo ezidlula ngokulula ikhulu lezigidi zeerandi ngeyunithi nganye, kodwa sithetha nangezityalo ezipheleleyo eziyilwe kufutshane nazo, ezineendawo zokucoca eziphambili, izixhobo zombane ezinamandla kakhulu, kunye neenkqubo zenkxaso ezintsonkothileyo kakhulu.

Oku kuthetha ukuba zimbalwa kuphela ii-founders kunye nee-IDM eziphezulu—i-TSMC, i-Samsung, i-Intel, kunye nezinye ezimbalwa—ezinokukwazi ukuthengisa i-EUV ngomlinganiselo omkhulu. Uninzi lwamashishini aseleyo luyaqhubeka nokusebenzisa i-DUV lithography, efikelelekayo kwaye ifanelekile ngokupheleleyo kwinjongo yayo. iitships ezingakhange ziphucuke kangako njengabo basebenza kwiimoto, kwii-elektroniki ezisetyenziswa ngabantu abaqhelekileyo, nakwiinkqubo ezininzi zoshishino.

Ukongeza, itekhnoloji isaqhubeka nokuba nzima imingeni yobugcisa Izinto ezibalulekileyo ziquka: amandla emithombo yokukhanya, ixesha elide lokusetyenziswa kweengubo ezibonakalayo ngokuchasene nemitha enamandla aphezulu, ubunzima beemaski ezibonisa ukukhanya, kunye nesidingo sokugcina imveliso ephezulu ngaphandle kokubangela iziphene kwi-wafer nganye—imiba eqhubeka iphuculwa kwisizukulwana emva kwesinye.

I-ASML, i-Intel, i-Samsung kunye ne-TSMC: uthotho lwezinto ezixhomekeke kuzo

Intsebenziswano phakathi kwe-ASML kunye nabavelisi abakhulu beetships ayisiyonto nje yobudlelwane phakathi kwabathengi nabathengisi. Umzekelo, i-Intel ityale imali kwi-intanethi. I-$4.000 yezigidigidi kwi-ASML ngo-2012 ukuxhasa uphuhliso loomatshini bokuqala be-EUV, ukuqinisekisa ukufikelela kwitekhnoloji kuqala, kunye nokuthatha inxaxheba ngokukhutheleyo kuphuhliso lwayo.

I-ASML okwangoku ihambisa iinkqubo zayo zokuqala ze-High-NA EUV kubathengi abanobuchule. Inkqubo yokuqala ye-Twinscan EXE:5200 ihanjiswe kwifektri ye-Intel eHillsboro, eCalifornia, inyathelo elihambelana nomgaqo wenkampani wokufikelela kwi-node yayo ye-18A (1,8 nm) kwisiqingatha sesibini sale minyaka ilishumi. vala umsantsa ngeTSMC kunye neSamsung kugqatso lobunkokeli kwezobuchwepheshe.

Okwangoku, iSamsung kunye neTSMC zikhuphisana ngobukhulu bemveliso ekhoyo ye-EUV kunye nokubaluleka kwayo ekuthunyelweni kwe-ASML. Ukulibaziseka kokuthunyelwa kwamanye amazwe—okubangelwe bubhubhane we-COVID-19—kuye kwabangela ukuba ngamanye amaxesha kubangele ukuba lungisa iimephu zendlela, hlehlisa ukuveliswa kwee-nodes ezifana ne-3nm kwaye uhlengahlengise ulwabiwo lwee-wafers phakathi kwabathengi abaxabisekileyo abafana ne-Apple, i-Qualcomm okanye abavelisi beemoto ezinkulu.

Lonke olu hlobo lwenkqubo luthetha ukuba ukufumaneka kweenkqubo ze-EUV, izinga lokuhanjiswa kwe-ASML, kunye nokuguquguquka kwe-Cymer, i-ZEISS, kunye nabanye ababoneleli kube zizinto ezibalulekileyo ekumiseleni Zeziphi iinkampani kunye namazwe abeka isantya? kwishishini le-semiconductor lesizukulwana esilandelayo.

I-Extreme ultraviolet photolithography izibonakalise njengesitshixo sokugcina uMthetho kaMoore uphila, ivelisa iitships ze-7, 5, kunye ne-3 nm, kwaye ingena kwi-2 nm nangaphantsi, kodwa ikwangumthombo onqabileyo nobiza kakhulu olawulwa ngabadlali abambalwa. Ukuqonda ifiziksi yayo, imingeni yayo, kunye nemarike yayo kusinceda sibone ukuba kutheni ifowuni yethu ephathwayo, imoto yethu, okanye ilifu esilisebenzisa imihla ngemihla lixhomekeke kwiimashini ezimbalwa ezinkulu ezisasazeke kwihlabathi liphela nakwi- Amandla e-ASML kunye namaqabane ayo okuqhubeka nokutyhala imida yetekhnoloji ye-EUV.

Inqaku elinxulumene nalo:

I-Apple kunye ne-Intel balungiselela umfelandawonye omtsha wokuvelisa iitshiphusi ze-M ezilandelayo.

UAlberto Navarro

Ndingumntu othanda itekhnoloji ojike umdla wakhe we "geek" waba ngumsebenzi. Ndichithe ngaphezulu kweminyaka eli-10 yobomi bam ndisebenzisa itekhnoloji yokusika kwaye ndikhenkceza ngazo zonke iintlobo zeenkqubo ngenxa yokufuna ukwazi okumsulwa. Ngoku ndiqeqeshelwe ubugcisa bekhompyutha nakwimidlalo yevidiyo. Oku kungenxa yokuba ngaphezu kweminyaka emi-5 ndibhalela iiwebhusayithi ezahlukeneyo kwitekhnoloji kunye nemidlalo yevidiyo, ndisenza amanqaku afuna ukukunika ulwazi oludingayo ngolwimi oluqondakalayo kuye wonke umntu.

Ukuba unayo nayiphi na imibuzo, ulwazi lwam lusuka kuyo yonke into enxulumene nenkqubo yokusebenza yeWindows kunye ne-Android yeefowuni eziphathwayo. Kwaye ukuzinikela kwam kukuwe, ndihlala ndikulungele ukuchitha imizuzu embalwa kwaye ndikuncede usombulule nayiphi na imibuzo onokuba nayo kweli lizwe le-intanethi.