- MediaTek will unveil the Dimensity 9500 on September 22 in China, with a peak clock above 4 GHz and a 3 nm (N3P) process.
- 1+3+4 CPU with Ultra core at 4,21 GHz, Mali-G1 Ultra MC12 GPU and next-generation NPU close to 100 TOPS.
- Significant improvements in efficiency and performance: up to +32% in single-core, +17% in multi-core, and -30% in consumption compared to the previous generation.
- Vivo X300 and OPPO Find X9 Pro are among the first to get it; scores have already been leaked on Geekbench and AnTuTu.
MediaTek has already set a date for its new flagship SoC: the presentation of the Dimensity 9500 will be celebrated today, September 22, in China, in a move that brings its big announcement forward to its rival's annual event. The chip arrives with a clear objective: taking high-end Android a step further with frequencies exceeding 4 GHz.
According to official information and consistent leaks, this processor is betting on a 1+3+4 CPU manufactured in 3 nm (N3P) by TSMC, accompanied by an Arm Mali-G1 Ultra MC12 GPU and a next-generation NPU close to 100 TOPS. Among the first candidates to launch it are strong vivo X300 and OPPO Find X9 Pro.
1+3+4 architecture and 3 nm process
The Dimensity 9500 adopts a configuration of high performance 1+3+4 with an Ultra «Travis» core up to 4,21 GHz, three "Alto" cores at 3,50 GHz and four "Gelas" at 2,70 GHz. This third iteration of the All Big Core approach seeks to combine sustained peak power and efficiency, relying on TSMC's N3P lithography.
To feed the whole, the design integrates 16 MB L3 cache and 10 MB SLC, LPDDR5X memory up to 10.667 Mbps and storage UFS 4.1 with 4 lines. According to internal figures and early tests, there is talk of +32% in single-core performance, +17% in multicore, a reduction in Ultra core consumption of up to 55% at maximum performance and up to -30% energy as a whole compared to the previous generation.
Graphics, screens and gameplay
The graphic section is in charge of Arm Mali-G1 Ultra MC12, where MediaTek aims to up to 120 FPS with effects ray tracing, a performance jump of around 33% and efficiency improvements approaching 42%. The firm is collaborating with studies to optimize compatible titles and squeeze the new GPU in demanding mobile games.
On displays, the SoC supports resolution WQHD+ and refresh rates up to 180 Hz. In addition, it incorporates an interface Tri-port MIPI for complex foldable devices and automatic color/contrast adjustments based on the environment, aimed at a more comfortable experience indoors and outdoors.
On-Device AI: NPU 990 and Generative Engine
The new NPU of ninth generation (MediaTek 990) reaches around 100 TOPS and debuts a suite of capabilities focused on generative AI and agentic. The Generative AI Engine 2.0 Doubles performance on INT and FP operations, supports contexts up to 128k tokens for text, and accelerates 4K image generation. Quantization LM BiNet 1.58-bit It also promises consumption cuts of up to 33%.
Advanced Array Extensions (SME) support and compiler optimizations combine to perform AI models on the phone itself with very low latency. The approach prioritizes vision, voice, and multimodal creation tasks, focusing on privacy and immediate response without relying on the cloud.
Cameras, connectivity and location
In the image, the ISP Imagiq 1190 enables RAW preprocessing, continuous focus tracking at 30 fps, and a revamped Portrait mode. In video, the chip supports 8K60, 4K at 120 fps with EIS and 4K60 in cinematic mode. The maximum camera figure reaches up to 320 MP, opening the door to next-generation sensors.
5G connectivity is supported by 3GPP Release 17 with cellular frequency bands, carrier aggregation (DL: Sub-6, 5CC up to 350 MHz with 4×4 MIMO; UL: 2CC up to 200 MHz), Dual SIM Dual Active and VoNR with 256QAM, along with MediaTek 5G UltraSave to reduce consumption. The goal is to balance top speed and range in real-world use.
For local networks, the SoC integrates Wi‑Fi 7 (TBTC) up to 7,3 Gbps and advanced dual-engine Bluetooth. Intelligent AI management is capable of predict congestion and adjust parameters to reduce the latency up to 50%, with performance improvements of around 20% in Wi‑Fi and 10% in 5G. In positioning, there is multi-band support for GPS, Galileo, BeiDou, Glonass, QZSS and NavIC.
First devices and performance already emerging
If there are no changes, alive will be one of the first to launch the Dimensity 9500 with its X300 series, where integration with the in-house V3 imaging chip is expected. Also being considered is the OPPO FIND X9 PRO between the initial models and the competition with chips like the Xiaomi's first proprietary chipsetThe launch event is scheduled for 14:00 PM local time in China on the 22nd.
The preliminary tests that have emerged show striking figures: in Geekbench, a Find X9 Pro with Dimensity 9500 has been around 3.394 points in single and 9.974 in multi, while a vivo X300 has been spotted in the range of 3.502/10.0k. In AnTuTu v11, and in the AnTuTu ranking, totals of around have been recorded 4,05 million pointsAs always, these numbers may vary depending on firmware, RAM, or heatsink.
MediaTek indicates that the first mobiles with this SoC would arrive in the last quarter, setting an aggressive schedule that seeks to capitalize on improvements in CPU, graphics, On-device AI, connectivity and efficiency to compete at the top of Android.
With a technical sheet that combines 4,21 GHz peak, TSMC N3P, 120 FPS Ray Tracing GPU, ~100 TOPS NPU and Wi‑Fi 7 plus 5G R17, the Dimensity 9500 is positioned as the MediaTek's most ambitious proposal to date, called to boost the flagships of the end of the year and the beginning of the next.
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